Technology Semiconductor & Chip Design Chip Manufacturing & Tapeout

Tapeout Readiness

Long-cycle design programs where IP, foundry, and ecosystem partnerships execute against tapeout and market windows.

TSMC Samsung Foundry GlobalFoundries Cadence
The journey flow
  1. Pre-Discovery
    1. Stakeholder & Foundry Alignment
    2. Current Database Snapshot
  2. Outcome Discovery
  3. Readiness Assessment Experience
  4. Solution Scope
  5. Mutual Commit
  6. Deployment
    1. Pre-Deployment Readiness
    2. Tapeout Execution
    3. Validation & Acceptance
  7. Success
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